发布时间 : 2024/4/29 3:58:34 星期一 文章烧结温度对电阻的影响更新完毕开始阅读de9eaa242f60ddccda38a0d2

摘要

摘要

钌系厚膜电阻以其优良的电气性能、良好的工艺重复性、稳定性好、阻值范围宽和可在大气中烧成等一系列优点，在厚膜集成电路中占有重要地位。

本文介绍了钌基厚膜电阻的概念，应用，发展状况，工艺流程和四种种导电机理。实验主要用到的是钌基厚膜电阻，主要是由钯银制成的。主要用隧道效应理论，通过实验可以得到不同峰值烧结温度、不同保温时间、不同升温速率时，厚膜电阻的方块电阻阻值及热温度系数也随之变化的结论。当峰值烧结温度较低时，形成的电阻体结构不致密、不均匀，导电颗粒之间和电阻体与电极之间的接触电阻大，厚膜电阻器呈现大的方块电阻阻值，当烧结峰值温度较高时 ,导电链中导电颗粒直接接触的几率下降，厚膜电阻器的方块电阻阻值也会比典型峰值温度烧成的高。

关键字：厚膜电阻器 温度 方块电阻 钌基

ABSTRACT

ABSTRACT

RuO2 thick film Resistance occupies an important place in the thick film integrated circuit due to its series advantage good repeatability ,stability and wind range of resistance ,burning in the atmosphere .

This paper introduces the concept ,its applications ,the development history of RuO2 thick film resistance ,the technological process and its four kind of conduction principle .this experiment mainly uses RuO2 thick film resistance which is made of resistance paste which is composed of Ag and Ru . Tunnel effect in semiconductors can explain the conclusion that when the temperature ,the holding time and the heating rates is different . Sheet resistance values of thick film resistance and RTC are also different .When the peak temperature is low ,the structure forming of the resistance is not density and uniform ,contact resistance between conductive particles and between resistance and electric pole is large ,tick film resistance show big sheet resistance values .When the turning temperature is high ,the probability of conduction between conductive particles is low ,the sheet resistance value of thick film resistance is higher than the typical peak temperature .

Keyword: thick film resistance conduct temperature sheet resistance

RuO2

目录

目录

第1章 绪论 ......................................................... 1

1.1厚膜集成电路 ................................................ 1

1.1.1厚膜集成电路的特点 .................................. 1 1.1.2 HIC的应用 .......................................... 2 1.1.3厚膜工艺原理 ........................................ 3 1.2厚膜电阻的概述 .............................................. 4

1.2.1概念 ................................................ 4 1.2.2用途 ................................................ 6 1.3厚膜电阻的发展历程 .......................................... 6 第2章 厚膜电阻的工艺流程及导电机理 ................................. 7

2.1工艺流程 .................................................... 7

2.1.1基片的选择 .......................................... 7 2.1.2厚膜导体浆料 ........................................ 9 2.1.3厚膜电阻浆料 ....................................... 10 2.1.4厚膜玻璃介质浆料 ................................... 10 2.1.5电阻修边（调方） ................................... 11 2.1.6丝网印刷工艺 ....................................... 12 2.2导电机理 ................................................... 13

2.2.1钯—银合金导电机理 ................................. 14 2.2.2氧化钯的半导体导电机理 ............................. 14 2.2.3金属或合金颗粒的接触电阻导电机理 ................... 15 2.2.4隧道效应导电机理 ................................... 16 2.3隧道势垒模型 ............................................... 17

2.3.1隧道势垒模型的概念 ................................. 17 2.3.2隧道势垒模型的基本内容 ............................. 18

第3章烧结温度对厚膜电阻的影响 ..................................... 21

3.1厚膜电阻浆料 ............................................... 21

目录

3.1.1厚膜电阻浆料分类 .................................... 21 3.1.2电阻浆料的制备 ...................................... 21 3.2烧结温度对厚膜电阻的影响 ................................... 22

3.2.1工艺工程数据 ........................................ 22 3.2.3实验数据及初步结论 .................................. 22

第4章 影响厚膜电阻性能的因素及展望 ................................. 25

4.1 工艺缺陷的成因及消除方法 ................................... 25

4.1.1线条变形,边缘呈锯齿状 ............................... 25 4.1.2 烧成中起泡 ......................................... 25 4.1.3 激光调阻后,阻值不稳定 .............................. 25 4.1.4 红外再流焊对表面组装元件的损伤 ..................... 26 4.1.5 再流焊中形成的锡珠 ................................. 26 4.2展望 ....................................................... 27

4.2.1避免起泡 ............................................ 27 4.2.2避免激光调阻的影响 .................................. 27 4.2.3避免红外再流焊的影响 ................................ 27 4.2.4避免再流焊中形成的锡珠 .............................. 27

第5章 结论 ......................................................... 29 致谢 ................................................................ 31 参 考 文 献 ......................................................... 33